The new reflectCONTROL RCS3500-300 is a 3D sensor for full-field warpage and flatness measurement of wafers with diameters of up to 300 mm. The entire wafer surface is captured in a single acquisition and precisely inspected for warpage, bow and local deformations. Deviations can thus be detected at an early stage before they affect subsequent process steps. The short measurement time enables efficient quality monitoring while maintaining consistently high production throughput, increasing process reliability, reducing scrap and lowering follow-up costs.
Full-field 3D deflectometry without stitching
Thanks to its large measuring range, the sensor measures the entire surface of wafers with diameters of up to 300 mm in a single acquisition. This produces a consistent 3D data set without mechanical scanning or combining multiple partial measurements, eliminating stitching errors. The deflectometry measuring principle is particularly suitable for highly reflective wafer surfaces and delivers stable measurement results even on mirror-like surfaces.
Short measurement times for high process speeds
The short acquisition time starting at 1 s reduces wafer standstill time and supports fast inspection sequences in automated processes. Calculated measured values, features and OK/NOK evaluations are available promptly. If defined limit values are exceeded, the controller can respond via the I/O signals and reject deformed wafers before further processing. This reliably safeguards subsequent process steps.
Flexible evaluation and integration
Depending on the integration concept, measurement data can be processed flexibly or evaluated using 3DInspect. In combination with the Industrial Performance Unit, PROFINET, EtherCAT and EtherNet/IP interfaces enable straightforward integration into industrial control environments. Alternatively, the user-friendly software development kit, based on the GigE Vision and GenICam industry standards, enables point cloud evaluation in custom software environments. The reflectCONTROL RCS3500-300 thus combines full-field measurement precision, short measurement times and flexible integration for greater process reliability and less scrap.